One component, dual cure epoxy for medical applications
EP&T Magazine
Production / Materials dual cure epoxy materials medical productionMASTER BOND UV15DC80-1Med one component, dual cure epoxy for medical applications provides a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn’t receive sufficient UV exposure, making it suitable for intricate parts and complex geometries. Adhesive meets ISO 10993-5 cytotoxicity standards, demonstrating biocompatibility for medical device applications. Product delivers resistance to radiation, liquid sterilants and autoclaving. The one part, no-mix epoxy has a moderate viscosity of 20,000-40,000 cps for versatile dispensing. It delivers strong bonds to various substrates, including metals, glass, ceramics, and many plastics, with a tensile strength exceeding 5,000 psi at 75°F.
